IC Packaging Technology for Electronic Watches

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

Reliability challenges in 3D IC packaging technology

0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.031 E-mail address: [email protected] At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order ...

MCM: The High-Performance Electronic Packaging Technology

Electromagnetic Emission Analysis for IC Packaging Structures

The IC packaging EMC/SI/PI problems have been broadly attested while its electromagnetic emissions are becoming increasingly significant as the data rate of digital system continues increasing. This paper focuses on EM emission behaviors for IC packaging structures. It is found that packaging EMI demonstrates clearly low and high frequency behaviors. Both theoretical analysis based on the first...

Technology Advances and Globalization in Electronic and Electro-Optical Packaging